AMAOE 1+9 Pro Middle Layer BGA Reballing Stencil for OnePlus 9 Pro

AMAOE 1+9 Pro Middle Layer BGA Reballing Stencil for OnePlus 9 Pro

β‚Ή229.00
Brand:
Model: 1+9PRO
Availability: In Stock
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Product Description

AMAOE 1+9 Pro Middle Layer BGA Reballing Stencil

The AMAOE 1+9 Pro is a middle-layer BGA reballing stencil designed for motherboard repair on the OnePlus 9 Pro. It is used by mobile repair technicians during solder-ball rework on compatible motherboard middle-layer layouts.

Product Features

  • Designed for OnePlus 9 Pro middle-layer motherboard reballing.
  • Helps position solder balls for compatible BGA pad layouts.
  • Suitable for professional mobile phone motherboard repair work.

Compatibility

  • OnePlus 9 Pro (1+9 Pro)

Note: Confirm the motherboard layout and stencil alignment before use.

🚚 Shipping & Delivery Information

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🌍 Important Note

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